1. 11 9548366
Self aligned contact scheme
Inventors: Tsai-Jung Ho; Kuang-Yuan Hsu; Pei-Ren Jeng 2. 8 9496189
Stacked semiconductor devices and methods of forming same
Inventors: Chen-Hua Yu; Chien-Hsun Lee; Tsung-Ding Wang; Jung Wei Cheng 3. 7 10510620
Work function metal patterning for N-P space between active nanostructures
Inventors: Daniel Chanemougame; Steven R. Soss; Steven Bentley; Julien Frougier; Ruilong Xie 3. 7 9281254
Methods of forming integrated circuit package
Inventors: Chen-Hua Yu; Chi-Hsi Wu; Wen-Chih Chiou; Hsiang-Fan Lee; Shih-Peng Tai; Tang-Jung Chiu 5. 6 10163798
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Inventors: Amruthavalli Pallavi Alur; Sri Ranga Sai Boyapati; Robert Alan May; Islam A. Salama; Robert L. Sankman 5. 6 10283493
Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof
Inventors: Akio Nishida 5. 6 10629616
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
Inventors: James Kai; Ching-Huang Lu; Murshed Chowdhury; Johann Alsmeier 5. 6 10833052
Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods
Inventors: Shing-Yih Shih 5. 6 7190064
Semiconductor device and method of manufacturing the same
Inventors: Takeshi Wakabayashi; Ichiro Mihara 5. 6 9666502
Discrete polymer in fan-out packages
Inventors: Hsien-Wei Chen; Jie Chen 5. 6 9735131
Multi-stack package-on-package structures
Inventors: An-Jhih Su; Chen-Hua Yu |