Semiconductors

Citations to U.S. patent application publications by U.S. patents granted in 2024

  1. 19 20180019369    DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
  Inventors: Hyunmin Cho; Daehyun Kim; Sungchul Kim; Jonghyuk Kang; Keunkyu Song; Jooyeol Lee; Hyundeok Im; Chio Cho; Hyeyong Chu; Sungjin Hong

  2. 17 20170062383    Package Structures and Methods of Making the Same
  Inventors: Kuo-Chung Yee; Chen-Hua Yu; Tsung-Ding Wang; Chien-Hsun Lee

  3. 16 20180175009    LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME
  Inventors: Dae Hyun Kim; Jong Hyuk KANG; Joo-yeol Lee; Hyun Deok IM; Hyun Min CHO

  4. 15 20180175106    LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME
  Inventors: Dae Hyun Kim; Jong Hyuk KANG; Joo-yeol Lee; Hyun Deok IM; Hyun Min CHO

  5. 11 20140252646    Interconnect Structure for Package-on-Package Devices
  Inventors: Jui-Pin Hung; Jing-Cheng Lin; Po-Hao Tsai; Yi-Jou Lin; Shuo-Mao Chen; Chiung-Han Yeh; Der-Chyang Yeh

  5. 11 20150362165    Light Engine Array
  Inventors: Chen-Fu Chu; Chen-Hsien Chu

  7. 10 20180102311    SEMICONDUCTOR PACKAGE UTILIZING EMBEDDED BRIDGE THROUGH-SILICON-VIA INTERCONNECT COMPONENT
  Inventors: Shing-Yih Shih

  7. 10 20180138101    PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
  Inventors: Chen-Hua Yu; Hsien-Pin Hu; Jing-Cheng Lin; Szu-Wei Lu; Shang-Yun Hou; Wen-Hsin Wei; Ying-Ching Shih; Chi-Hsi Wu

  7. 10 20190148342    Integrating Passive Devices in Package Structures
  Inventors: Chih-Chia Hu; Ming-Fa Chen

  7. 10 20200294998    BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
  Inventors: Aaron D. Lilak; Ehren Mannebach; Anh Phan; Richard E. Schenker; Stephanie A. Bojarski; Willy Rachmady; Patrick Morrow; Jeffery D. Bielefeld; Gilbert Dewey; Hui Jae Yoo

  1. 89 20100025766    TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SUCH A TRANSISTOR DEVICE
  Inventors: Sebastien Nuttinck; Gilberto Curatola

  2. 72 20160293398    DEPOSITION OF CONFORMAL FILMS BY ATOMIC LAYER DEPOSITION AND ATOMIC LAYER ETCH
  Inventors: Michal Danek; Jon Henri; Shane Tang

  3. 71 20070111386    Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
  Inventors: Sarah Kim; R. Scott List; Scot Kellar

  3. 71 20100102417    VAPOR DEPOSITION METHOD FOR TERNARY COMPOUNDS
  Inventors: Seshadri Ganguli; Srinivas Gandikota; Sang Ho Yu; Luis Felipe Hakim

  3. 71 20160211166    MOVEABLE EDGE COUPLING RING FOR EDGE PROCESS CONTROL DURING SEMICONDUCTOR WAFER PROCESSING
  Inventors: Haoquan Yan; Robert Griffith O'Neill; Raphael Casaes; Jon McChesney; Alex Paterson

  3. 71 20190172714    HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM
  Inventors: Sarah Michelle Bobek; Prashant Kumar Kulshreshtha; Rajesh Prasad; Kwangduk Douglas Lee; Harry Whitesell; Hidetaka Oshio; Dong-Hyung LEE; Deven Matthew Raj Mittal

  7. 70 20090269507    SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
  Inventors: Sang Ho Yu; Kevin Moraes; Seshadri Ganguli; Hua Chung; See-Eng Phan

  7. 70 20150217330    SELECTIVE DEPOSITION OF METALS, METAL OXIDES, AND DIELECTRICS
  Inventors: Suvi Haukka; Raija H. Matero; Eva Tois; Antti Niskanen; Marko Tuominen; Hannu Huotari; Viljami Pore; Ivo Raaijmakers

  9. 69 20140263172    RESIST HARDENING AND DEVELOPMENT PROCESSES FOR SEMICONDUCTOR DEVICE MANUFACTURING
  Inventors: Peng Xie; Christopher Dennis Bencher; Huixiong Dai; Timothy Michaelson; Subhash Deshmukh

  9. 69 20150004806    LOW-K OXIDE DEPOSITION BY HYDROLYSIS AND CONDENSATION
  Inventors: Nicholas Muga Ndiege; Krishna Nittala; Derek Wong; George Andrew Antonelli; Nerissa Draeger; Patrick A. Van Cleemput

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