Micro-Structural and Nano-Technology

Citations to U.S. patent application publications by U.S. patents granted in 2024

Related WIPO fields:[Semiconductors | Materials, metallurgy | Optics | Measurement | Basic materials chemistry | Electrical machinery, apparatus, energy | Computer technology All WIPO fields
[Cited by Examiner | Cited by Applicant]
Most Cited by Examiners

  1. 11 20200294998    BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
  Inventors: Aaron D. Lilak; Ehren Mannebach; Anh Phan; Richard E. Schenker; Stephanie A. Bojarski; Willy Rachmady; Patrick Morrow; Jeffery D. Bielefeld; Gilbert Dewey; Hui Jae Yoo

  2. 8 20200044087    SUB-FIN ISOLATION SCHEMES FOR GATE-ALL-AROUND TRANSISTOR DEVICES
  Inventors: Biswajeet Guha; William Hsu; Tahir Ghani

  3. 7 20200066839    I/O DEVICE SCHEME FOR GATE-ALL-AROUND TRANSISTORS
  Inventors: Jingyun Zhang; Alexander Reznicek; Choonghyun Lee; Xin Miao

  3. 7 20200373300    MULTI-THRESHOLD VOLTAGE GATE-ALL-AROUND TRANSISTORS
  Inventors: Jingyun Zhang; Takashi Ando; Choonghyun Lee

  3. 7 20210036121    SEMICONDUCTOR DEVICES INCLUDING A GATE ISOLATION STRUCTURE AND A GATE CAPPING LAYER INCLUDING DIFFERENT MATERIALS FROM EACH OTHER
  Inventors: Kangmook Lim; Sangsu Kim; Wooseok Park; Daekwon Joo

  6. 6 20170110554    INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
  Inventors: Yong-Suk Tak; Gi-gwan Park; Tae Jong Lee; Bon-Young Koo; Ki-Yeon Park; Sung-Hyun Choi

  6. 6 20170200738    SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
  Inventors: Bo Soon Kim; Hyun-Ji Kim; Jeong-Yun Lee; Gi-gwan Park; Sang-Duk Park; Young Mook Oh; Yong Seok Lee

  6. 6 20170256609    SEMICONDUCTOR DEVICE
  Inventors: Krishna Kumar Bhuwalka; Seong Je Kim; Jong Chol Kim; Hyun-Woo Kim

  6. 6 20190067490    SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF
  Inventors: Jung Gil Yang; Woo Seok Park; Dong Chan Suh; Seung Min Song; Geum-Jong Bae; Dong II BAE

  6. 6 20200035567    WORK FUNCTION METAL PATTERNING FOR N-P SPACES BETWEEN ACTIVE NANOSTRUCTURES USING UNITARY ISOLATION PILLAR
  Inventors: Daniel Chanemougame; Ruilong Xie; Chanro Park; Guillaume Bouche

  6. 6 20200126987    INTERLAYER VIA CONTACTS FOR MONOLITHIC THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES
  Inventors: Joshua M. Rubin; Nicolas Loubet; Terence B. Hook

  6. 6 20200266060    GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICES HAVING SOURCE/DRAIN EXTENSION CONTACTS TO CHANNEL LAYERS FOR REDUCED PARASITIC RESISTANCE
  Inventors: Kangguo Cheng; Yi Song; Zhenxing Bi

[Cited by Examiner | Cited by Applicant]
Most Cited by Applicants

  1. 24 20070111386    Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
  Inventors: Sarah Kim; R. Scott List; Scot Kellar

  2. 22 20080108171    RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS
  Inventors: John A. Rogers; Ralph G. Nuzzo; Matthew Meitl; Heung Cho Ko; Jongseung Yoon; Etienne Menard; Alfred J. Baca

  2. 22 20090294861    SRAM MEMORY CELL HAVING TRANSISTORS INTEGRATED AT SEVERAL LEVELS AND THE THRESHOLD VOLTAGE VT OF WHICH IS DYNAMICALLY ADJUSTABLE
  Inventors: Olivier Thomas; Perrine Batude; Arnaud Pouydebasque; Maud Vinet

  2. 22 20170069601    MEMORY DEVICE WITH SEPARATED CAPACITORS
  Inventors: Min Sang Park

  2. 22 20180294284    Approach to the manufacturing of monolithic 3-dimensional high-rise integrated-circuits with vertically-stacked double-sided fully-depleted silicon-on-insulator transistors
  Inventors: Ahmad Tarakji; Nirmal Chaudhary

  6. 21 20020081823    Generic layer transfer methodology by controlled cleavage process
  Inventors: Nathan W. Cheung; Francois J. Henley

  6. 21 20020113289    Method and apparatus for thermal management of integrated circuits
  Inventors: Michael James Cordes; Steven A. Cordes; Uttam Shyamalindu Ghoshal; Errol Wayne Robinson; James L. Speidell

  6. 21 20020132465    Reconfigurable integrated circuit memory
  Inventors: Glenn J. Leedy

  6. 21 20030060034    Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
  Inventors: Eric Beyne; Augustin Coello-Vera; Olivier Vendier

  6. 21 20040033676    Electronic components and method of fabricating the same
  Inventors: Philippe Coronel; Francois Leverd; Thomas Skotnicki

  6. 21 20040036126    Tri-gate devices and methods of fabrication
  Inventors: Robert S. Chau; Brian S. Doyle; Jack T. Kavalieros; Douglas Barlage; Suman Datta

  6. 21 20040113207    Vertical MOSFET SRAM cell
  Inventors: Louis L. Hsu; Oleg Gluschenkov; Jack A. Mandelman; Carl Radens

  6. 21 20040195572    Semiconductor device
  Inventors: Kiyoshi Kato; Toru Takayama; Junya Maruyama; Yuugo Goto; Yumiko Ohno

  6. 21 20040219765    Method of forming a multi-layer semiconductor structure incorporating a processing handle member
  Inventors: Rafael Reif; Kuan-Neng Chen; Chuan Seng Tan; Andy Fan

  6. 21 20040229444    Glass-based SOI structures
  Inventors: James Gregory Couillard; Kishor Purushottam Gadkaree; Joseph F. Mach

  6. 21 20050003592    All-around MOSFET gate and methods of manufacture thereof
  Inventors: A. Jones

  6. 21 20050225237    Oled microcavity subpixels and color filter elements
  Inventors: Dustin L. Winters

  6. 21 20050280061    Vertical memory device structures
  Inventors: Sang-Yun Lee

  6. 21 20060024923    Deep alignment marks on edge chips for subsequent alignment of opaque layers
  Inventors: Chandrasekhar Sarma; Ihar Kasko

  6. 21 20060049449    Non-volatile semiconductor memory and method for fabricating a non-volatile semiconductor memory
  Inventors: Naohisa Iino; Yasuhiko Matsunaga; Fumitaka Arai

  6. 21 20060071322    Automatic trace determination method and apparatus for automatically determining optimal trace positions on substrate using computation
  Inventors: Tamotsu Kitamura

  6. 21 20060181202    Color organic OLED device
  Inventors: Liang-Sheng Liao; Kevin P. Klubek; Ching W. Tang

  6. 21 20070014508    Monlithically coupled waveguide and phototransistor
  Inventors: Young-Kai Chen; Vincent Houtsma; Andreas Leven; Nils Weimann

  6. 21 20070132369    Transparent contacts for organic devices
  Inventors: Stephen R. Forrest; Mark E. Thompson; Paul E. Burrows; Vladimir Bulovic; Gong Gu

  6. 21 20070141781    Multi-bit non-volatile memory devices and methods of fabricating the same
  Inventors: Yoon-dong Park; Won-joo Kim

  6. 21 20070215903    POWER SEMICONDUCTOR DEVICE
  Inventors: Kozo Sakamoto; Toshiaki Ishii

  6. 21 20070218622    Method of fabricating local interconnects on a silicon-germanium 3D CMOS
  Inventors: Jong-Jan Lee; Paul J. Schuele; Sheng Teng Hsu; Jer-Shen Maa

  6. 21 20080038902    SEMICONDUCTOR BONDING AND LAYER TRANSFER METHOD
  Inventors: Sang-Yun Lee

  6. 21 20080099819    NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
  Inventors: Masaru Kito; Hirofumi Inoue

  6. 21 20080242028    METHOD OF MAKING THREE DIMENSIONAL NAND MEMORY
  Inventors: Nima Mokhlesi; Roy E. Scheuerlein

  6. 21 20080254561    METHOD OF FABRICATING VERTICAL STRUCTURE COMPOUND SEMICONDUCTOR DEVICES
  Inventors: Myung Cheol Yoo

  6. 21 20080254623    METHODS FOR GROWING LOW-RESISTIVITY TUNGSTEN FOR HIGH ASPECT RATIO AND SMALL FEATURES
  Inventors: Lana Hiului Chan; Kaihan Ashtiani; Joshua Collins

  6. 21 20080261378    Method for Growth of Gan Single Crystal, Method for Preparation of Gan Substrate, Process for Producing Gan-Based Element, and Gan-Based Element
  Inventors: Takafumi Yao; Meoung Whan Cho

  6. 21 20080315253    FRONT AND BACKSIDE PROCESSED THIN FILM ELECTRONIC DEVICES
  Inventors: Hao Yuan; Guogong Wang; Mark A. Eriksson; Paul G. Evans; Max G. Lagally; Zhenqiang Ma

  6. 21 20090039918    THREE DIMENSIONAL INTEGRATED CIRCUITS
  Inventors: Raminda Udaya Madurawe

  6. 21 20090052827    Silicon-Compatible Surface Plasmon Optical Elements
  Inventors: Charles G. Durfee; Reuben T. Collins; Thomas E. Furtak

  6. 21 20090070727    Three dimensional integrated circuits and methods of fabrication
  Inventors: Neal Solomon

  6. 21 20090078970    SEMICONDUCTOR DEVICE
  Inventors: Shunpei Yamazaki; Atsuo Isobe; Hiromichi Godo; Yutaka Okazaki

  6. 21 20090161401    Multi-die Memory, Apparatus and Multi-die Memory Stack
  Inventors: Christoph Bilger; Peter Gregorius; Michael Bruennert; Maurizio Skerlj; Wolfgang Walthes; Johannes Stecker; Hermann Ruckerbauer; Dirk Scheideler; Roland Barth

  6. 21 20090185407    Semiconductor Memory Device Having Transistors of Stacked Structure
  Inventors: Han-Byung Park; Soon-Moon Jung; Hoon Lim

  6. 21 20090218627    FIELD EFFECT DEVICE STRUCTURE INCLUDING SELF-ALIGNED SPACER SHAPED CONTACT
  Inventors: Huilong Zhu

  6. 21 20090250686    METHOD FOR FABRICATION OF SEMIPOLAR (Al, In, Ga, B)N BASED LIGHT EMITTING DIODES
  Inventors: Hitoshi Sato; Hirohiko Hirasawa; Roy B. Chung; Steven P. DenBaars; James S. Speck; Shuji Nakamura

  6. 21 20100025766    TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SUCH A TRANSISTOR DEVICE
  Inventors: Sebastien Nuttinck; Gilberto Curatola

  6. 21 20100059796    Shared masks for x-lines and shared masks for y-lines for fabrication of 3D memory arrays
  Inventors: Roy E. Scheuerlein

  6. 21 20100133704    Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
  Inventors: Pandi C. Marimuthu; Nathapong Suthiwongsunthorn; Il Kwon Shim; Kock Liang Heng

  6. 21 20100137143    METHODS AND APPARATUS FOR MEASURING ANALYTES
  Inventors: Jonathan M. Rothberg; Wolfgang Hinz; John F. Davidson; Antoine M. van Oijen; John Leamon; Martin Huber

  6. 21 20100232200    VERTICAL SWITCH THREE-DIMENSIONAL MEMORY ARRAY
  Inventors: Daniel R. Shepard

  6. 21 20100289144    3D INTEGRATION STRUCTURE AND METHOD USING BONDED METAL PLANES
  Inventors: Mukta G. Farooq; Subramanian S. lyer

  6. 21 20110001172    THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
  Inventors: Sang-Yun Lee

  6. 21 20110027967    METHOD FOR INSERTION BONDING AND DEVICE THUS OBTAINED
  Inventors: Eric Beyne; Paresh Limaye

  6. 21 20110037052    METALORGANIC CHEMICAL VAPOR DEPOSITION (MOCVD) GROWTH OF HIGH PERFORMANCE NON-POLAR III-NITRIDE OPTICAL DEVICES
  Inventors: Mathew C. Schmidt; Kwang Choong Kim; Hitsohi Sato; Steven P. DenBaars; James S. Speck; Shuji Nakamura

  6. 21 20110049336    SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
  Inventors: Takeshi Matsunuma

  6. 21 20110102014    THREE DIMENSIONAL INTEGRATED CIRCUITS
  Inventors: Raminda Udaya Madurawe

  6. 21 20110111560    Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced Thereby
  Inventors: Sampath Purushothaman; Mary E. Rothwell; Ghavam G. Shahidi; Roy Yu

  6. 21 20110134683    SEMICONDUCTOR DEVICE
  Inventors: Shunpei Yamazaki; Jun Koyama; Kiyoshi Kato

  6. 21 20110227158    3D INTEGRATED CIRCUIT STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
  Inventors: Huilong Zhu

  6. 21 20110314437    METHODS AND SYSTEMS FOR COMPUTER AIDED DESIGN OF 3D INTEGRATED CIRCUITS
  Inventors: Lisa G. McIlrath

  6. 21 20120146193    Thermal Conduction Paths for Semiconductor Structures
  Inventors: Michael A. Stuber; Chris Brindle; Stuart B. Molin

  6. 21 20130026663    METHOD FOR CURING DEFECTS IN A SEMICONDUCTOR LAYER
  Inventors: Ionut Radu; Christophe Gourdel; Christelle Vetizou

  6. 21 20130187720    TEMPERATURE COMPENSATION TYPE OSCILLATOR
  Inventors: Takehito Ishii

  6. 21 20130203248    INTEGRATED CIRCUIT HAVING A JUNCTIONLESS DEPLETION-MODE FET DEVICE
  Inventors: Thomas Ernst; Marie-Anne Jaud; Perrine Batude

  6. 21 20130207243    Method of Manufacturing a Semiconductor Device
  Inventors: Edward Fuergut; Joachim Mahler

  6. 21 20150021785    HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
  Inventors: Jing-Cheng Lin

  6. 21 20150279829    WAFER PACKAGE PROCESS
  Inventors: Chien-Li Kuo

  6. 21 20160104780    Semiconductor Devices and Methods of Manufacturing Thereof
  Inventors: Anton Mauder; Hans-Joachim Schulze; Hans-Joerg Timme; Franz Hirler; Francisco Javier Santos Rodriguez

  6. 21 20170092371    CAPACITIVE-COUPLED NON-VOLATILE THIN-FILM TRANSISTOR STRINGS IN THREE DIMENSIONAL ARRAYS
  Inventors: Eli Harari

  6. 21 20170148517    THREE-DIMENSIONAL VERTICAL NOR FLASH THIN FILM TRANSISTOR STRINGS
  Inventors: Eli Harari

  6. 21 20180090368    ISOLATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
  Inventors: Eun Jeong Kim; Jin Yul Lee; Han-Sang Song; Su Ho Kim

  6. 21 20190006009    Three-dimensional Vertical NOR Flash Thin-Film Transistor Strings
  Inventors: Eli Harari

 
 
References:
Raw data from: U.S. Patent and Trademark Office. "Data Download Tables." PatentsView. Accessed July 19, 2025. https://patentsview.org/download/data-download-tables.

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Published: August 19, 2025