Surface Technology, Coating

Citations to U.S. patents by U.S. patents granted in 2025

Related WIPO fields:[Semiconductors | Electrical machinery, apparatus, energy | Materials, metallurgy | Other special machines | Basic materials chemistry | Macromolecular chemistry, polymers | Chemical engineering All WIPO fields  | Top 10 Overall | Main Page
[Cited by Examiner | Cited by Applicant]
Most Cited by Examiners  Dot Plot

  1. 6 4865245    Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
  Inventors: Eric F. Schulte; Eric D. Olson

  1. 6 6471115    Process for manufacturing electronic circuit devices
  Inventors: Masahito Ijuin; Toru Nishikawa; Ryohei Sato; Mitsugu Shirai; Yuzo Taniguchi; Kosuke Inoue; Masahide Harada; Tetsuya Hayashida

  1. 6 6551860    Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
  Inventors: Jason R. Uner; Thierry Sindzingre; Claude Carsac

  1. 6 6712260    Bump reflow method by inert gas plasma
  Inventors: Wen-Chang Kuo; Chia-Fu Lin; Sheng-Liang Pan; Szu-Yao Wang; Cheng-Yu Chu

  1. 6 6870270    Method and structure for interfacing electronic devices
  Inventors: Mauro J. Kobrinsky; R. Scott List; Sarah E. Kim; Michael C. Harmes

  1. 6 8163094    Method to improve indium bump bonding via indium oxide removal using a multi-step plasma process
  Inventors: H. Frank Greer; Todd J. Jones; Richard P. Vasquez; Michael E. Hoenk; Matthew R. Dickie; Shouleh Nikzad

  1. 6 8967452    Thermal compression bonding of semiconductor chips
  Inventors: Yiu Ming Cheung; Tsan Yin Peter Lo; Ming Li; Yick Hong Mak; Ka San Lam

  8. 5 6578334    Building board and manufacturing method thereof
  Inventors: Morimichi Watanabe

  9. 4 10472833    Floor panel and method for manufacturing floor panels
  Inventors: Frank Loncke; Luc Vanhastel; Laurent Meersseman

  9. 4 10677275    Floor element for forming a floor covering, a floor covering and a method for manufacturing a floor element
  Inventors: Claudio Caselli; Rahul Patki; Jan Eddy De Rick

  9. 4 11937492    Mask assembly and manufacturing method thereof
  Inventors: Duckjung Lee

  9. 4 6253957    Method and apparatus for dispensing small amounts of liquid material
  Inventors: James W. Messerly; Laurence B. Saidman; James C. Smith

  9. 4 8966845    Insulated reinforced foam sheathing, reinforced vapor permeable air barrier foam panel and method of making and using same
  Inventors: Romeo Ilarian Ciuperca

[Cited by Examiner | Cited by Applicant]
Most Cited by Applicants  Dot Plot

  1. 44 8728956    Plasma activated conformal film deposition
  Inventors: Adrien LaVoie; Shankar Swaminathan; Hu Kang; Ramesh Chandrasekharan; Tom Dorsh; Dennis M. Hausmann; Jon Henri; Thomas Jewell; Ming Li; Bryan Schlief; Antonio Xavier; Thomas W. Mountsier; Bart J. van Schravendijk; Easwar Srinivasan; Mandyam Sriram

  2. 41 5916365    Sequential chemical vapor deposition
  Inventors: Arthur Sherman

  2. 41 6270572    Method for manufacturing thin film using atomic layer deposition
  Inventors: Yeong-kwan Kim; Sang-in Lee; Chang-soo Park; Sang-min Lee

  2. 41 7651959    Method for forming silazane-based dielectric film
  Inventors: Atsuki Fukazawa; Jeongseok Ha; Nobuo Matsuki

  5. 40 6534395    Method of forming graded thin films using alternating pulses of vapor phase reactants
  Inventors: Christiaan J. Werkhoven; Ivo Raaijmakers; Suvi P. Haukka

  6. 39 6428859    Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
  Inventors: Tony P. Chiang; Karl F. Leeser

  6. 39 7297641    Method to form ultra high quality silicon-containing compound layers
  Inventors: Michael A. Todd; Keith D. Weeks; Christiaan J. Werkhoven; Christophe F. Pomarede

  6. 39 7482247    Conformal nanolaminate dielectric deposition and etch bag gap fill process
  Inventors: George D. Papasouliotis; Raihan M. Tarafdar; Ron Rulkins; Dennis M. Hausmann; Jeff Tobin; Adrianne K. Tipton; Bunsen Nie; Wai-Fan Yau; Brian G. Lu; Timothy M. Archer; Sasson Roger Somekh

  6. 39 7622369    Device isolation technology on semiconductor substrate
  Inventors: Woo Jin Lee; Atsuki Fukazawa; Nobuo Matsuki

  10. 38 6287965    Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor
  Inventors: Sang-bom Kang; Hyun-seok Lim; Yung-sook Chae; In-sang Jeon; Gil-heyun Choi

  10. 38 6448192    Method for forming a high dielectric constant material
  Inventors: Vidya S. Kaushik

  10. 38 6511539    Apparatus and method for growth of a thin film
  Inventors: Ivo Raaijmakers

  10. 38 7582555    CVD flowable gap fill
  Inventors: Chi-I Lang; Judy H. Huang; Michael Barnes; Sunil Shanker

  10. 38 7989365    Remote plasma source seasoning
  Inventors: Soonam Park; Soo Jeon; Toan Q. Tran; Jang-Gyoo Yang; Qiwei Liang; Dmitry Lubomirsky

  10. 38 8187679    Radical-enhanced atomic layer deposition system and method
  Inventors: Eric R. Dickey; William A. Barrow

  10. 38 9564312    Selective inhibition in atomic layer deposition of silicon-containing films
  Inventors: Jon Henri; Dennis M. Hausmann; Bart J. van Schravendijk; Shane Tang; Karl F. Leeser

 
 
References:
Raw data from: U.S. Patent and Trademark Office "Open Data Portal." Accessed May 13, 2026. http://data.uspto.gov/bulkdata/datasets/pvgpatdis?fileDataFromDate=1976-01-01&fileDataToDate=2025-12-31.

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Published: May 18, 2026